Jida Chen
Jida Chen, Professor
Email: chencqu@cqu.edu.cn, Phone: 17784256784
Chen obtained his BS degree in Appllied Chemistry from Chongqing University in 1984, MS degree in Physical Chemistry from Chongqing University in 1987. Since 1987, he is a teacher in Chongqing University. He received his Ph.D degree from Chongqing University in 2001. From 2001 to 2003, he was a postdoctoral fellow in Fudan University. From 2005 to 2007, he was a visiting scholar in Georgia Institute of Technology,USA. Prof. Chen’s research interests focus on Corrosion Inhibition, Ion Imprinted Nanomaterials, Key Techniques for Printed Circuit Industry.
Selected Papers:
1. Denglin Fu, Yanan Wen, Jida Chen*, Lansi Lu, Chaohui Liao, Lizhao Sheng, Wei He, Shijin Chen. Study on fine circuit and undercut suppression of printed circuit board prepared by electrolytic etching. Circuit World, Article in Press, 2021.
2. Wenjun Zeng, Wenpo Li*, Bochuan Tan, Jia Liu, Jida Chen*. A research combined theory with experiment of 2-Amino-6-(Methylsulfonyl) Benzothiazole as an excellent corrosion inhibitor for copper in H2SO4 medium. Journal of the Taiwan Institute of Chemical Engineers，000 (2021) 1-13.
3. Ting Yan, Li Feng, Lansi Lu, Denglin Fu, Feng Chen, Yanan Wen, Shulei Fu, Zhibo Deng, Rou Zhang, Jida Chen*, Bochuan Tan*. Investigation of imidazole derivatives as inhibitors for the corrosion of copper in 0.5 M sulfuric acid. Journal of the Taiwan Institute of Chemical Engineers, 106:118-129, 2020.
4. Denglin Fu, Bochuan Tan, Lansi Lu，Xin Qin, Shijin Chen, Wei He, Jida Chen*. Study on the Corrosion Inhibition Effect of 2,3-Dimercapto-1-propanol on Copper in 0.5mol/L H2SO4 Solution. International Journal of electrochemical science, 13 (9):8561-8574, 2018.
5. Huirong He, Jida Chen*, Shengtao Zhang, Minhui Liao, Lingxing Li, Wei He, Yuanming Chen, Shijin Chen. Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified full-additive method. Circuit World, 43(3): 131-138, 2017.
6. Jiali Yang, Lansi Lu, Zhu Zhang, Minhui Liao, Huirong He, Lingxing Li, Jida Chen* and Shijin Chen. Preparation and Adsorption Property of Imido-acetic Acid Type Chelating Nano-fibers by Electro-spinning Technique, In IOP Conf. Series: Materials Science and Engineering, 275:012001, 2017.
7. Jia Liu，Jiali Yang，Zhu Zhang， Wei He，Shijin Chen，Zhidan Li，Jida Chen*. A copper electroplating formula for BVHs and THs filling at one process. Circuit world, 42(3):141-151, 2016.
8. Xuan Liu, Jiali Yang, Lanyan Tong, Qian Zhang, Xiaowei Li, Jida Chen*. Preparation of Cu(Ⅱ)-Imprinted Nanofibers Via Co-Electrospinning PVA and Imprinting Complex. Chemical Research in Chinese Universities,31 (6): 1062-1065, 2015.
9. Lanyan Tong, Jida Chen*, Youyou Yuan, Zehua Cui, Mianfu Ran，Qian Zhang, Juan Bu, Fengqing Yang, Xinhong Su and Huan Xu. A Novel Lead Ion-Imprinted Chelating Nanofiber: Preparation, Characterization and Performance Evaluation. Journal of Applied Polymer Science，132(8):41507, 2015.
10. Xiaowei Li, Jia Liu，Shengtao Zhang，Wei He，Shijin Chen，Zhidan Li, Jida Chen*. Study on process technique of PCBs with ladder conductive lines. Circuit world, 41(1):34-40,2015.
